Semiconductor Test Board
Semiconductor
Test Board
Probe Card Board · Load Board · Socket Board · Burn-in Board 반도체 검사공정에서 특성 검사, 내열성 검사 및 연결 소켓보드에 적용되며, 높은 절연성, 내열성, 저유전율 · 저유전손실이 요구되는 소재가 적용됩니다.
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CCL & PPG
Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC) EM-827(I) 2.6 160 4.1/3.5 0.024/0.027 EM-370(Z) 1.8 180 4.2/3.8 0.015/0.019 EM-888S 2.4 170 3.7/3.2 0.0073/0.0079 EM-891K 2.2 170 3.1/3.0 0.0032/0.0033 EM-890K 2.2 170 3.0/2.8 0.0025/0.0024 EM-S526 1.3 230 3.9/3.4 0.0070/0.0076 EM-528 1.4 220 3.9/3.4 0.0062/0.0058 85N(EM-85N) 1.2 250 4.2
(@1Mhz, 54% RC)0.01
(@1Mhz, 54% RC) -
Copper Foil
Product Cross Section Image Bonding Side JIS94 Rz(um) LP310 
≤9.5(1 oz)
≤7.2(H oz)LP410 
≤9.5(1 oz)
≤7.2(H oz)RT311 
≤3.0 SLD01 
≤3.0
CCL & PPG (적용분야)
| Product Guide | IC Package | Semiconductor Test Board | Consumer Electronics | Data Storage | Network · Server · Satellite | Automotive | Aircraft Avionics |
Aerospace Defense |
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Middle Tg |
EM-825(I) |
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| EM-285 |
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| EM-370(5) |
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| EM-355(D) |
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High Tg |
EM-827(I) |
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| EM-370(Z) |
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| EM-390 |
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| EM-888(S)/888K |
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| EM-891/891K |
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| EM-890/890K |
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| EM-892/892K2 |
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| EM-828(G) |
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| EM-A50 |
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| 35N |
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| 85N(EM-85N) |
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| 85NT |
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| 85HP |
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| Substrate | EM-S526 |
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| EM-528/528K |
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| EM-S530/S530K |
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| EM-S570/S570K |
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| EM-LXE |
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| Metal | EM-MP/MPC |
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| FIYTA Heat Sink Coin |
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Copper Foil (적용분야)
| Product Guide | IC Package | Semiconductor Test Board | Consumer Electronics | Data Storage | Network · Server · Satellite | Automotive | Aircraft · Avionics | Aerospace · Defense | |
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| CCL/PCB | LP310/LP410 |
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| HG310 |
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| RT311 |
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RG311 (Advanced RTF) |
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| SLD01 |
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RG312 (Advanced RTF) |
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RG313 (Advanced RTF) |
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VL410 (HVLP) |
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VG410 (HVLP2) |
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VL411 (HVLP3) |
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PF511 (HVLP4) |
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| RF313 |
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VF413 (HVLP2) |
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| LH408 |
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RP410 (VLP) |
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