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CCL & Prepreg

CCL & Prepreg

Copper Clad Laminate (동박적층판), Prepreg (프리프레그) 및 Copper Foil (동박)은 전자부품의 회로를 입체적으로 연결하는 Multilayer Laminated Board (다층인쇄회로기판)의 핵심 기본 소재입니다. 다층인쇄회로기판 성능의 우수성은 동박적층판과 프리프레그 및 동박의 품질과 특성에 의해 결정됩니다. 랜드마크는 초창기부터 친환경 소재를 사용한 할로겐 프리 제품을 세계 정상의 PCB 업체에 공급하고 있으며, 고속 데이터 전송 (5G & 6G)에 적합하고 고주파수 대역에서 우수한 성능을 보이는 안정된 품질의 고사양 소재를 지속적으로 공급 및 개발하고 있습니다.

  • Regular Lead Free (Halogenated)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-825(I) 3.2 140 4.2/3.6 0.021/0.025
    EM-827(I) 2.6 160 4.1/3.5 0.024/0.027
  • Mid. Loss (Halogen-Free)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-285 2.8 150 4.2/3.7 0.015/0.016
    EM-370(5) 2.6 150 4.2/3.8 0.017/0.019
    EM-355(D) 2.8 150 3.8/3.3 0.013/0.015
    EM-370(D) 2.2 170 4.0/3.5 0.015/0.017
    EM-370(Z) 1.8 180 4.2/3.8 0.015/0.019
    EM-828(G) 2.6 160 3.8/3.3 0.011/0.013
    EM-390 2.2 165 3.8/3.3 0.011/0.012
  • Low Loss (Halogen-Free)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-888 2.6 170 3.7/3.2 0.0073/0.0079
    EM-888(S) 2.4 170 3.7/3.2 0.0073/0.0079
    EM-A50 1.3 230 3.9/3.4 0.0070/0.0080
    EM-S526 1.3 230 3.9/3.4 0.0070/0.0076
  • Very Low Loss (Halogen-Free and Halogenated)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-888K 2.4 170 3.2/3.1 0.0062/0.0074
    EM-528 1.4 220 3.9/3.4 0.0062/0.0058
    EM-891 2.2 170 3.6/3.1 0.0053/0.0046
  • Ultra Low Loss (Halogen-Free and Halogenated)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-891K 2.2 170 3.1/3.0 0.0032/0.0033
    EM-528K 1.4 220 3.4/3.2 0.0041/0.0042
    EM-890 2.2 170 3.4/3.0 0.0046/0.0036
    EM-S530 1.3 235 3.65/3.16 0.0052/0.0042
    EM-S530K 1.3 235 3.24/2.95 0.0028/0.0027
  • Ultra Low CTE (Halogen-Free)
    Product CTE X/Y-axis (PPM/°C) Tg (TMA℃) Dk@1GHz (50% RC) Df@1GHz (50% RC)
    EM-S570 4/6 280 4.4 0.005
  • Hyper Low Loss (Halogen-Free)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-890K 2.2 170 3.0/2.8 0.0025/0.0024
    EM-890K2 2.2 170 2.9/2.7 0.0021/0.0021
    EM-892K 1.8 180 3.00/2.84 0.0019/0.0017
    EM-892K2 1.8 180 2.90/2.76 0.0014/0.0013
  • IC Package (Halogen-Free)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-LXE 0.6 260 3.9/3.5 0.012/0.012
    EM-S526 1.3 230 3.9/3.4 0.0070/0.0076
    EM-528 1.4 220 3.9/3.4 0.0062/0.0058
    EM-528K 1.4 220 3.4/3.2 0.0041/0.0042
  • Low Flow PP (Halogen-Free)
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-285B(L) 2.8 150 4.2/3.7 0.015/0.016
  • Metal (Halogen-Free)
    Product CTE, Z-axis (PPM/°C) Tg Thermal Conductivity
    Alpha 1, TMA Alpha 2, TMA (DSC/℃) (W/mK)
    EM-MP/MPC 30 150 120 2.0
    FIYTA Heat Sink Coin - - - Copper 386
    Aluminum 239
  • Polyimide (Halogen-Free and Halogenated)
    Product Z-CTE (%) (51~260℃) Tg (TMA℃) Dk@ 1Mhz (54% RC) Df@ 1Mhz (54% RC)
    35N 1.2 250 4.2 0.01
    85N 1.2 250 4.2 0.01
    85NT 2.3 250 3.6 0.014
    85HP 1 250 4.2 0.09