Data Storage
Data
Storage
DDR Board · SSD Board · NAND Flash Board 고속 · 고용량 저장 기술 변화에 지속적인 대응으로 안정성을 인정받아 오랜 기간 공급해온 친환경 소재가 적용됩니다.
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CCL & PPG
Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC) EM-285 2.8 150 4.2/3.7 0.015/0.016 EM-370(Z) 1.8 180 4.2/3.8 0.015/0.019 EM-390 2.2 165 3.8/3.3 0.011/0.012 EM-S526 1.3 230 3.9/3.4 0.0070/0.0076 EM-528 1.4 220 3.9/3.4 0.0062/0.0058 -
Copper Foil
Product Cross Section Image Bonding Side JIS94 Rz(um) LP310 
≤9.5(1 oz)
≤7.2(H oz)LP410 
≤9.5(1 oz)
≤7.2(H oz)RT311 
≤3.0 RG311
(Advanced RTF)
≤2.3 SLD01 
≤3.0
CCL & PPG (적용분야)
| Product Guide | IC Package | Semiconductor Test Board | Consumer Electronics | Data Storage | Network · Server · Satellite | Automotive | Aircraft Avionics |
Aerospace Defense |
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Middle Tg |
EM-825(I) |
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| EM-285 |
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| EM-370(5) |
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| EM-355(D) |
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High Tg |
EM-827(I) |
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| EM-370(Z) |
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| EM-390 |
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| EM-888(S)/888K |
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| EM-891/891K |
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| EM-890/890K |
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| EM-892/892K2 |
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| EM-828(G) |
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| EM-A50 |
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| 35N |
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| 85N(EM-85N) |
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| 85NT |
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| 85HP |
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| Substrate | EM-S526 |
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| EM-528/528K |
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| EM-S530/S530K |
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| EM-S570/S570K |
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| EM-LXE |
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| Metal | EM-MP/MPC |
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| FIYTA Heat Sink Coin |
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Copper Foil (적용분야)
| Product Guide | IC Package | Semiconductor Test Board | Consumer Electronics | Data Storage | Network · Server · Satellite | Automotive | Aircraft · Avionics | Aerospace · Defense | |
|---|---|---|---|---|---|---|---|---|---|
| CCL/PCB | LP310/LP410 |
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| HG310 |
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| RT311 |
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RG311 (Advanced RTF) |
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| SLD01 |
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RG312 (Advanced RTF) |
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RG313 (Advanced RTF) |
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VL410 (HVLP) |
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VG410 (HVLP2) |
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VL411 (HVLP3) |
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PF511 (HVLP4) |
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| RF313 |
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VF413 (HVLP2) |
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| LH408 |
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RP410 (VLP) |
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