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IC Package

IC Package

IC Substrate 미세한 반도체 Chip을 PCB에 실장이 용이하도록 전기적, 기계적, 열적으로 연결시키는 회로기판입니다. IC Chip과 PCB 의 스케일이 다름을 보완하기 위하여 고밀도 · 고집적 디자인된 기판으로 높은 절연성, 내열성, 저유전율 · 저유전손실 및 저신축율이 요구되는 소재가 적용됩니다.

  • CCL & PPG
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-370(Z) 1.8 180 4.2/3.8 0.015/0.019
    EM-S526 1.3 230 3.9/3.4 0.0070/0.0076
    EM-528 1.4 220 3.9/3.4 0.0062/0.0058
    EM-528K 1.4 220 3.4/3.2 0.0041/0.0042
    EM-S530 1.3 235 3.65/3.16 0.0052/0.0042
    EM-S530K 1.3 235 3.24/2.95 0.0028/0.0027
    EM-LXE 0.6 260 3.9/3.5 0.012/0.012
  • Copper Foil
    Product Cross Section Image Bonding Side
    JIS94 Rz(um)
    RP410
    (VLP)
    ≤3.0

CCL & PPG (적용분야)

Product Guide IC Package Semiconductor Test Board Consumer Electronics Data Storage Network · Server · Satellite Automotive Aircraft
Avionics
Aerospace
Defense
Middle
Tg
EM-825(I)
1 EM-285
EM-370(5)
EM-355(D)
High
Tg
EM-827(I)
EM-370(Z)
EM-390
EM-888(S)/888K
EM-891/891K
EM-890/890K
EM-892/892K2
EM-828(G)
EM-A50
35N
85N(EM-85N)
85NT
85HP
Substrate EM-S526
EM-528/528K
EM-S530/S530K
EM-S570/S570K
EM-LXE
Metal EM-MP/MPC
FIYTA Heat Sink Coin

Copper Foil (적용분야)

Product Guide IC Package Semiconductor Test Board Consumer Electronics Data Storage Network · Server · Satellite Automotive Aircraft · Avionics Aerospace · Defense
CCL/PCB LP310/LP410
HG310
RT311
RG311
(Advanced RTF)
SLD01
RG312
(Advanced RTF)
RG313
(Advanced RTF)
VL410
(HVLP)
VG410
(HVLP2)
VL411
(HVLP3)
PF511
(HVLP4)
RF313
VF413
(HVLP2)
LH408
RP410
(VLP)