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Consumer Electronics

Consumer Electronics

Smartphone Board · Tablet PC and Laptop Computer Board · Digital Camera Board 스마트폰, 태블릿 PC, 노트북 및 웨어러블 기기 등 고사양 전자제품에 보편적으로 적용되는 다층인쇄회로기판의 할로겐 프리 소재가 적용됩니다.

  • CCL & PPG
    Product Z-CTE (%) (50~260℃) Tg (TMA℃) Dk@10GHz (50%, 70% RC) Df@10GHz (50%, 70% RC)
    EM-825(I) 3.2 140 4.2/3.6 0.021/0.025
    EM-285 2.8 150 4.2/3.7 0.015/0.016
    EM-370(5) 2.6 150 4.2/3.8 0.017/0.019
    EM-827(I) 2.6 160 4.1/3.5 0.024/0.027
    EM-370(Z) 1.8 180 4.2/3.8 0.015/0.019
    EM-390 2.2 165 3.8/3.3 0.011/0.012
    EM-S526 1.3 230 3.9/3.4 0.0070/0.0076
    EM-528 1.4 220 3.9/3.4 0.0062/0.0058
    EM-S530 1.3 235 3.65/3.16 0.0052/0.0042
  • Copper Foil
    Product Cross Section Image Bonding Side
    JIS94 Rz(um)
    LP310 ≤9.5(1 oz)
    ≤7.2(H oz)
    LP410 ≤9.5(1 oz)
    ≤7.2(H oz)
    RT311 ≤3.0
    SLD01 ≤3.0

CCL & PPG (적용분야)

Product Guide IC Package Semiconductor Test Board Consumer Electronics Data Storage Network · Server · Satellite Automotive Aircraft
Avionics
Aerospace
Defense
Middle
Tg
EM-825(I)
1 EM-285
EM-370(5)
EM-355(D)
High
Tg
EM-827(I)
EM-370(Z)
EM-390
EM-888(S)/888K
EM-891/891K
EM-890/890K
EM-892/892K2
EM-828(G)
EM-A50
35N
85N(EM-85N)
85NT
85HP
Substrate EM-S526
EM-528/528K
EM-S530/S530K
EM-S570/S570K
EM-LXE
Metal EM-MP/MPC
FIYTA Heat Sink Coin

Copper Foil (적용분야)

Product Guide IC Package Semiconductor Test Board Consumer Electronics Data Storage Network · Server · Satellite Automotive Aircraft · Avionics Aerospace · Defense
CCL/PCB LP310/LP410
HG310
RT311
RG311
(Advanced RTF)
SLD01
RG312
(Advanced RTF)
RG313
(Advanced RTF)
VL410
(HVLP)
VG410
(HVLP2)
VL411
(HVLP3)
PF511
(HVLP4)
RF313
VF413
(HVLP2)
LH408
RP410
(VLP)